Riskcovery

CVE-2016-2063

State
Published
Severity
Not scored
Published
Aug 7, 2016
Updated
Aug 5, 2024
Reserved
Jan 25, 2016

Read the record on cve.org

Description

Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.

Scores

The record has no CVSS score.

Weaknesses

The record names no weakness.

Affected Products

ProductVersions
n/an/a
  • n/aAffected

References

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