Riskcovery

CVE-2017-18157

State
Published
Severity
Not scored
Published
May 6, 2019
Updated
Aug 5, 2024
Reserved
Feb 5, 2018

Read the record on cve.org

Description

A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.

Scores

The record has no CVSS score.

Weaknesses

The record names no weakness.

Affected Products

ProductVersions
Snapdragon Automobile, Snapdragon Mobile, Snapdragon WearQualcomm Technologies, Inc.
  • MDM9206Affected
  • MDM9607Affected
  • MDM9650Affected
  • MSM8909WAffected
  • MSM8996AUAffected
  • SD 210/SD 212/SD 205Affected
  • SD 425Affected
  • SD 450Affected
  • SD 615/16/SD 415Affected
  • SD 625Affected
  • SD 650/52Affected
  • SD 820Affected
  • SD 820AAffected
  • SD 835Affected
  • SD 845Affected
  • SDX20Affected

References

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