CVE-2018-11277

State: Published
Severity: Not scored
Published: Sep 20, 2018
Updated: Aug 5, 2024
Reserved: May 18, 2018

Description

In Snapdragon (Automobile, Mobile, Wear) in version MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, the com.qualcomm.embms is a vendor package deployed in the system image which has an inadequate permission level and allows any application installed from Play Store to request this permission at install-time. The system application interfaces with the Radio Interface Layer leading to potential access control issue.

Scores

The record has no CVSS score.

Weaknesses

The record names no weakness.

Affected Products

Product	Versions
Snapdragon Automobile, Snapdragon Mobile, Snapdragon WearQualcomm, Inc.	MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660Affected

References

https://www.qualcomm.com/company/product-security/bulletins

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