CVE-2021-42114

Scalable Rowhammering In the Frequency Domain to Bypass TRR Mitigations On Modern DDR4/LPDDR4X Devices

State
Published
Severity
9.0 Critical
Published
Nov 16, 2021
Updated
Sep 17, 2024
Reserved
Oct 8, 2021

Read the record on cve.org

Description

Modern DRAM devices (PC-DDR4, LPDDR4X) are affected by a vulnerability in their internal Target Row Refresh (TRR) mitigation against Rowhammer attacks. Novel non-uniform Rowhammer access patterns, consisting of aggressors with different frequencies, phases, and amplitudes allow triggering bit flips on affected memory modules using our Blacksmith fuzzer. The patterns generated by Blacksmith were able to trigger bitflips on all 40 PC-DDR4 DRAM devices in our test pool, which cover the three major DRAM manufacturers: Samsung, SK Hynix, and Micron. This means that, even when chips advertised as Rowhammer-free are used, attackers may still be able to exploit Rowhammer. For example, this enables privilege-escalation attacks against the kernel or binaries such as the sudo binary, and also triggering bit flips in RSA-2048 keys (e.g., SSH keys) to gain cross-tenant virtual-machine access. We can confirm that DRAM devices acquired in July 2020 with DRAM chips from all three major DRAM vendors (Samsung, SK Hynix, Micron) are affected by this vulnerability. For more details, please refer to our publication.

Scores

CVSSScoreVectorSource
3.19.0 CriticalCVSS:3.1/AV:N/AC:H/PR:N/UI:N/S:C/C:H/I:H/A:HNCSC.ch

Weaknesses

  • CWE-20 Improper Input Validation

Affected Products

ProductVersions
Micron ddr4_sdramMicron
  • 1Affected
Samsung ddr4_sdramSamsung
  • 1Affected
SK Hynix ddr4_sdramSK Hynix
  • 1Affected
Micron lpddr4Micron
  • 1Affected
Samsung lpddr4Samsung
  • 1Affected
SK Hynix lpddr4SK Hynix
  • 1Affected

References

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